CAPS

Ternoa 价格 
CAPS

¥0.1372  

0.97% (1天)

Ternoa兑换为CNY的图表

Loading Data

请耐心等待,我们正在加载图表数据

加入自选列表
Ternoa统计数据
市值
 

0.97%

¥176,629,020
#796
交易量(24小时)
 

4.85%

¥4,101,009
#1397
交易量/市值(24小时)
 
2.32%
流通供应量
 
1,287,030,207 CAPS
总供应量
 
2,500,000,000 CAPS
最大供应量
 
--
完全稀释的市值
 
¥343,094,162
CAPS兑换为CNY的转换器
CAPS
CNY
价格表现
24小时 
最低价
¥0.1305
最高价
¥0.1417
历史高点
Jun 07, 2021 (3 years ago)
¥1.62
-91.55%
历史低点
Nov 21, 2022 (a year ago)
¥0.04219
+225.29%
查看历史数据
热门程度
加入自选列表的次数24,631x
1232nd / 9.7K
您是该项目的所有者吗? 更新代币信息


Loading Data

请耐心等待,我们正在加载图表数据

Ternoa community

 
 
 
 
 
 
 
 
 
 
skeleton-white

Ternoa markets

所有交易对

Loading data...

免责声明:本页面可能包含联署营销链接。如果您访问任何此类联署营销链接,并且在这些联署营销平台上进行如注册或交易等操作,CoinMarketCap 将可获得报酬。请参阅《联署营销信息披露》

Ternoa新闻

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

关于Ternoa

Ternoa is a multi-network and cross-layer protocol leveraging confidential computing technologies to make blockchain more secure, private and scalable.

Our tech stack combines distributed ledger and confidential computing technologies to provide decentralized yet private development environments for next generation applications. Ternoa comprises of 3 independent, yet interconnected networks:

Ternoa Chain: A WASM Layer 1 blockchain network built on Substrate where builders can deploy ink! smartcontracts coded in Rust, C, C++ or Typescript, and call pre-coded primitives through a JavaScript SDK (mainnet since April 2022)

Ternoa Fortress: A decentralized TEE-powered coprocessor network, implemented as a key management system, enabling users to encrypt off-chain data with on-chain encryption keys (mainnet since September 2023)

Ternoa zkEVM: A Layer 2 validium secured with TEE multi-proofs, offering a full EVM equivalent environment where builders can deploy solidity smartcontracts (mainnet planned for 2024)

Since the beginning Ternoa has been envisioned as a comprehensive protocol enabling new privacy and security use cases. Our TEE-powered tech stack has been live and available as a mainnet L1 since 2022, prompting us to develop a multi-layer and multi-chain architecture, set for delivery in 2024.